High stable UV QE is attained by a combination of optimised AR coatings and controlling the charge state at the back surface. This is achieved by depositing materials as part of the back-thinning process using novel technology. Of particular focus has been the design and development of three families of AR coatings to optimise the optical performance achieving stable high quantum efficiency (QE) at VUV and UV wavelengths. Due to the high line frequency of 18 Hz, for instance, the maximum.
#CCD DETECTOR CHIP SIDE LENGTH IMAGING UPGRADE#
The upgrade to 8 inch wafer processing includes the development of low reflection coatings over the light shielded part of the image sensors being of particular relevance to new Teledyne product families, especially very large area sensors, which will enable the provision of CMOS and CCD devices that almost completely fill an 8 inch wafer. Pixels with an edge length of 14 or 10 m are preferentially used in line scan cameras. Teledyne e2v has recently upgraded the operation to process 8 inch wafers with optimised anti-reflection (AR) coatings for applications from ultraviolet (UV) to near infrared for applications such as ground and space astronomy, science and other applications.
#CCD DETECTOR CHIP SIDE LENGTH IMAGING SOFTWARE#
The back-thinning process has been developed and refined over many years to the stage where it is a reliable wafer scale operation, with proven variety of optimisations for different wavelength applications. Here the CCD controller software is written in such a way that the images generated contain regions (usually two narrow strips on either side of the chip) that. Our well established ability to back-thin image sensors is an important component of our capability. The photoresist of the previous lithographic step is removed and.
were smaller than, or equal in size to, the edge packet. The scratch protection will complete the processing of a typical black-and-white image sensor. This EEV chip, on the other hand, had its reflectivity. Teledyne e2v has a broad range of specialist on die anti-reflective (AR) coatings, package surface treatment and window spectral filter design and process capabilities including up to 8 inch silicon wafer back-thinning and die, package and optical window coatings and filters. The Toad 2 prototype (Figure 1) is a TDI mode CCD-like image sensor chip designed by e2v. For CCDs, the designer typically chooses a wavelength near the middle of the visible band, around 550 nm.